Zoom
Description
Features of GIGABYTE B850M Gaming X WIFI6E AMD Motherboard
X3D Turbo Mode
Unleash New Era Gaming Performance with One-Click Activation.
X3D Turbo Mode's unique optimization parameters allow even Ryzen™ 9000 X3D gaming Performance enhance & Ryzen™ 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen™ X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency with GIGABYTE's BIOS innovation- X3D Turbo Mode.
Exclusive BIOS Design
Advanced BIOS functionality provides seamless optimization of industry-leading DDR5 memory performance.
AMD EXPO™ Settings
Optimize memory with AMD's user-friendly profiles.
Boost Performance
Boost Performance: Get the most out of your system's memory.
AMD EXPO™ User Profile
Harness the power of AMD profiles to fine-tune your memory for outstanding system performance.
Custom SPD Profiles
Create and manage two unique SPD profiles, ready to transfer between machines.
Fast Performance Simulation
Automatically adjusts clock and timing parameters, quickly simulating optimal memory performance.
Profile Management
Save and load your preferred memory settings, and share them with ease.
Enhance non-overclockable DDR5 Speeds
Push the limits of your non-overclockable DDR5 memory with boosted frequencies.
Instant Reset
One-click to clear and restore memory settings for quick adjustments.
Unmatched Hardware Excellence
Elevate your gaming with our state-of-the-art technology for a superior experience.
Shielded Memory Routing
Advanced shielding inside the PCB keeps your memory signals clean and interference-free.
Daisy-Chained Routing
Innovative design removes signal bottlenecks, allowing for blazing-fast memory speeds and a superior gaming setup.
AORUS AI SNATCH
Unleash Ultimate Performance with One-Click Activation.
Auto CPU & DDR5 Memory Boost
With just a single click, unleash the full potential of CPU & DDR5 memory, instantly boosting your gaming and work efficiency.
One-Click Acceleration:
Enhance CPU & DDR5 speeds with a single click.
- Real time Analyze
- OC accuracy UP
- EZ to Pro
Fast AI Performance
Accelerate AI processing for greater performance
Up to
8%
AI Performance*
- Accelerated AI decision-making
- Boosted reinforcement learning
- Streamlined language processing
Boost CPU & Memory Performance
Raise system speed and performance.
Up to
9%
CPU & Memory Performance Boost
- Tailored-overclocking for your CPU and memory
- Faster data transfer and application loading
- Improved multitasking performance
- Optimized overall system performance
AI-Driven PCB Technology -Redefining PCB Design with Artificial Intelligence
AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.
- AI-ViaFusion Technology
Optimized vias & pads for signal integrity
- AI-Trace Technology
Smart routing for peak performance
- AI-Layer Technology
Tailored stackups for enhanced functionality
Key Features:
AI-Generated Design Recipes
AI-Driven Simulation
AI-Powered Signal Verification
Single and cross-layer signal optimization
AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity
Reduction in Signal Reflection Up to 28.2%
AI-ViaFusion, an AI-assisted via optimization technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficiency, outperforming traditional design methods.
Best-in-class Signal Quality
- Superior signal transmission efficiency
- Dramatically reduced signal reflection
- Elevated signal quality and reliability
- Enhanced cross-layer PCB signal performance
AI-ViaFusion Technology - AI-Engineered Via Design Formula
AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to enhance high-speed signal transmission.
- Optimized Via Design
Varied via sizes for optimized signal and power paths
- Driven Pad Optimization
Custom pad sizes for performance and production balance
- Precision Impedance Matching
Via & pad sizes selected for optimal signal impedance
Unlock AI-Powered Performance with AI-ViaFusion Technology
- Minimized Insertion Loss
Optimized vias reduce signal loss
- Enhanced Return Loss
Precision impedance matching reduces reflections
- Optimized Eye Diagram
Wider eye opening improves signal integrity
AI-ViaFusion Technology - AI-Driven Revolution in PCB Design
Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting capacitance, reflections, and crosstalk.
AI-ViaFusion Technology optimizes PCB performance through:
- Strategic Via Sizing
Optimized for varied signals across PCB
- Enhanced Impedance Matching
Precise control via machine learning
- Space Optimization
Maximized layout efficiency with signal integrity
AI-Trace Technology-Revolutionizing PCB Routing with AI
AI-Trace Technology transforms PCB design by leveraging AI to optimize trace routing, resulting in enhanced performance and signal integrity.
- Fiber Weave Effect Mitigation
Optimized signal synchronization
- Shielded Memory Routing
Optimized signal shielding and precision
- Impedance-Optimized Topology
Refined traces with minimal resistance
- Isolated Memory Routing
Optimized trace layout and layer separation
- Daisy-Chained Routing
Innovative design eliminates signal bottlenecks
Mitigating Fiber Weave Effect with AI-Trace Technology
Fiber Weave Effect in high-speed PCBs stems from varying dielectric constants of epoxy resin and glass fibers, this causes varying signal propagation speeds, leading to signal integrity issues such as crosstalk and jitter. AI-Trace Technology implements innovative routing angles to mitigate this effect.
Benefits of Mitigation:
- Reduces signal distortion
- Improves transmission reliability
- Supports higher data rates
- Enhances overall system stability
AI-Layer Technology -Next-Generation Multi-Layer PCB Design
AI-Layer Technology creates innovative layer materials for multi-layer PCBs, delivering unparalleled performance.
Core Innovation: AI-Optimized Layer Customized Design
- AI-optimized layer design
- Unique material for each layer
- AI-verified signal integrity
- Tailored PCB for peak performance
EZ Debug Zone
Centralized debug LEDs and control buttons provide a handy and organized troubleshooting process when building a new computer.
Multi-key
A flexible control key for reset with BIOS-level reconfiguration options for diverse usage scenarios.
RGB Switch
Disable all light displays on the motherboard.
Direct-To-BIOS
Access the BIOS settings directly without keyboard inputs.
Safe Mode
Access BIOS safe mode to modify select settings while preserving other configurations.
Born from Ultra Durable™
Technology embodies our commitment to excellence, providing gamers with a platform that's not only powerful but also built for longevity and reliability. GAMING series motherboards are engineered to endure and excel.
Multi-Theme
Now users can choose different BIOS themes with one simple click It not only delivers an immersive user experience but also offers a brand new user-friendly theme: Grayscale.
AIO Fan Control
Enable non-windows users to adjust AIO fan speed in the BIOS before entering the OS.
Refined BIOS Interface
GIGABYTE User-Centred (UC) BIOS elevates the interface, delivering an optimized experience through an easy-to-navigate layout and attractive design for optimal usability.
Quick Access Function
GIGABYTE UC BIOS' Quick Access function selects brings 9 key options from Advanced Mode directly into Easy Mode, enabling swift adjustments without extensive navigation.
Spotlight your flair
Liberate your imagination using GCC's versatile illumination options for your motherboard. Tailor your setup with eye-catching displays that mirror your unique personality and preferences.
Varnish your shine
Programmable RGB LED connectors enable precise control over individual LEDs (for ARGB GEN2 devices), seamlessly managed through the GCC.
AORUS & HWiNFO Co-branded OSD
AORUS and HWiNFO co-branded OSD(On-Screen Display) can display values as text or graphs in an overlay or independent window, also in full-screen applications and games, with no need for additional software installation.
Default AORUS skin
When using HWiNFO on a GIGABYTE motherboard, a custom AORUS-themed interface automatically activates, offering light and dark options. This AORUS Skin can be manually applied to non-GIGABYTE boards as well.
Specifications of GIGABYTE B850M Gaming X WIFI6E AMD Motherboard
| model | B850M-GAMING-X-WF6E |
| CPU | AMD Socket AM5, support for: AMD Ryzen™ 9000 Series Processors/ AMD Ryzen™ 8000 Series Processors/ AMD Ryzen™ 7000 Series Processors (Go to GIGABYTE's website for the latest CPU support list.) |
| Chipset | AMD B850 |
| Memory | Support for DDR5 8400(OC) / 8200(OC) / 8000(OC) / 7800(OC) / 7600(OC) / 7200(OC) / 7000(OC) / 6800(OC) / 6666(OC) / 6600(OC) / 6400(OC) / 6200(OC) / 6000(OC) / 5600(OC) / 5200 / 4800 / 4400 MT/s memory modules 2 x DDR5 DIMM sockets supporting up to 128 GB (64 GB single DIMM capacity) of system memory Dual channel memory architecture Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for AMD EXtended Profiles for Overclocking (AMD EXPO™) and Extreme Memory Profile (XMP) memory modules (The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to "Memory Support List" on GIGABYTE's website for more information.) |
| Onboard Graphics | Integrated Graphics Processor with AMD Radeon™ Graphics support: - 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz * Support for HDMI 2.1 version and HDCP 2.3, and HDR. ** Support for native HDMI 2.1 TMDS compatible ports. - 2 x DisplayPorts, supporting a maximum resolution of 3840x2160@144 Hz * Support for DisplayPort 1.4 version. (Graphics specifications may vary depending on CPU support.) Support for up to triple-display at the same time |
| Audio | Realtek® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel |
| LAN | Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) |
| Wireless Communication module | Realtek® Wi-Fi 6E RTL8852CE - WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands - BLUETOOTH 5.3 - Support for 11ax 160MHz wireless standard (Actual data rate may vary depending on environment and equipment.) |
| Expansion Slots | 1 x PCI Express x16 slot (PCIEX16), integrated in the CPU: AMD Ryzen™ 9000/7000 Series Processors support PCIe 5.0 x16 mode AMD Ryzen™ 8000 Series-Phoenix 1 Processors support PCIe 4.0 x8 mode AMD Ryzen™ 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4 mode * The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot. Chipset: - 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x4 (PCIEX4) |
| Storage Interface | 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 25110/22110/2580/2280 SSDs: AMD Ryzen™ 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4/x2 SSDs 1 x M.2 connector (M2B_CPU), integrated in the CPU, supporting Socket 3, M key, type 25110/22110/2580/2280 SSDs: AMD Ryzen™ 9000/7000 Series Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 2 Processors support PCIe 4.0 x2 SSDs 4 x SATA 6Gb/s connectors RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices * RAID 5 is only available on AMD Ryzen™ 9000 Series Processors. RAID 0, RAID 1, and RAID 10 support for SATA storage devices |
| USB | CPU: - 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support - 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel CPU+USB 2.0 Hub: - 4 x USB 2.0/1.1 ports on the back panel Chipset: - 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header - 4 x USB 3.2 Gen 1 ports (2 ports on the back panel, 2 ports available through the internal USB header) - 4 x USB 2.0/1.1 ports available through the internal USB headers |
| Internal I/O Connectors | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 1 x CPU fan/water cooling pump header 1 x system fan header 1 x system fan/water cooling pump header 3 x addressable RGB Gen2 LED strip headers 1 x RGB LED strip header 4 x SATA 6Gb/s connectors 2 x M.2 Socket 3 connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C® header, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only) 1 x reset button 1 x reset jumper 1 x Clear CMOS jumper |
| Back Panel Connectors | 1 x HDMI port (Note) 2 x DisplayPorts (Note) 1 x Q-Flash Plus button 1 x PS/2 keyboard/mouse port 1 x USB 3.2 Gen 2 Type-A ports (red) 1 x USB Type-C® port, with USB 3.2 Gen 2 support 2 x USB 3.2 Gen 1 ports 4 x USB 2.0/1.1 ports 1 x RJ-45 port 2 x antenna connectors (2T2R) 3 x audio jacks (Note) Actual support may vary by CPU |
| I/O Controller | iTE® I/O Controller Chip |
| H/W Monitoring | Voltage detection Temperature detection Fan speed detection Water cooling flow rate detection Fan fail warning Fan speed control |
| BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
| Unique Features | Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. Support for Q-Flash Support for Q-Flash Plus Support for Smart Backup |
| Operating System | Support for Windows 11 64-bit Support for Windows 10 64-bit |
| Form Factor | Micro ATX Form Factor; 24.4cm x 24.4cm |
Reviews ( 0 )
Frequently asked questions
Wishlist
Wishlist is empty.
Compare
Shopping cart
