TOP DOWN COOLING DESIGN
Top Down Cooling design allows heat to dissipate more quickly and efficiently while offering higher compatibility with cases.
HEAT CORE TOUCH TECHNOLOGY (HCTT)
3 Heatpipes provide a perfectly flat and smooth surface to maximize contact surface area.
This allows for minimal heat transfer loss while in direct contact with the CPU to increase the efficiency of heat dissipation.
PWM HIGH-PRESSURE FAN
120mm high-pressure fan provides a stronger airflow to push heat away from the aluminum fins faster.
HIGH EFFICIENCY FINS
Upgraded high efficiency fins for maximum thermal performance.
Black coating on fins allows for faster heat absorption, improving cooling efficiency.
COMPATIBILITY
Compatible with most current motherboard designs.
Socket compatibility: LGA 115X/775
AM4/AM3+/AM3/AM2+/AM2/FM2/FM1