DEEPCOOL EX750 3G Thermal Paste

Features of DEEPCOOL EX750 3G Thermal Paste

DeepCool EX750 high performance thermal paste is crafted for extremely low thermal resistance for efficient heat dissipation in any scenario.

• A smooth consistency allows for easier application and helps fill in every microchannel between surfaces for excellent thermal conductivity.
• Thermal Impedance : 0.03°C·cm²/W
• Grease Weight : 3 g
• Operating Temperature : -50°C to +250°C

THE BEST MATCH, EVERY TIME

A smooth consistency allows for easier application and helps fill in every microchannel between surfaces for excellent thermal conductivity.

SAFE AND STABLE

DeepCool EX750 is a highly stable thermal compound and not electrically conductive or hazard to your PC components.

INDUSTRIAL GRADE THERMAL INTERFACE

DeepCool EX750 offers extremely low thermal resistance that® maximizes heat transfer and dissipation for high performance CPU & GPU (desktop/laptop) components.

Specifications of DEEPCOOL EX750 3G Thermal Paste