Zoom











Your one stop destination for all your Computer needs!











Cooling performance doesn’t always require a second tower.
It comes from understanding how heat moves.
The V8 ACE 3DHP combines patented 3D Heat Pipe technology (3DHP), SCCHP heat pipes, and dual 30 mm fans into a thermal system engineered to maximize cooling performance in a single-tower design.
Every part of the V8 ACE 3DHP is designed around one goal: managing heat more effectively. Follow the path from heat pickup to heat dissipation to see how each component contributes to One As Two.
Independent testing ranked the V8 ACE 3DHP AMD second overall among every air cooler tested, including larger dual-tower designs.
Conventional U-shaped heat pipes move heat through two ends. Patented 3DHP technology adds a third branch that reaches the CPU hotspot, creating an additional path for heat to move into the cooler.
Two patented 3DHP heatpipes capture heat at the CPU hotspot. Four SCCHP heatpipes distribute it across the fin stack. Together, they create a unified thermal system.
Traditional heatpipe layouts concentrate heat in a smaller area of the heatsink. The hybrid 3DHP architecture spreads heat farther across the fin stack, allowing more of the cooler to participate in heat dissipation.
The front and rear fans are engineered for different airflow roles. One builds pressure to push cool air through the heatsink. The other efficiently pulls heated air away. Together, they maximize cooling performance while helping reduce unwanted noise.
Liquid Crystal Polymer provides twice the structural strength needed to resist blade deformation and vibration at higher speeds. That stability maintains tighter tip clearance, reducing air leakage and supporting stronger static pressure.
Intel and AMD processors don’t generate or transfer heat the same way. Separate V8 ACE 3DHP models tailor the base geometry, heatpipe design, and thermal capacity to the platform they are built to cool.
The V8 ACE 3DHP delivers the cooling performance of much larger air coolers in a compact single-tower design. That leaves more room around the CPU socket for memory, motherboard components, and future upgrades without sacrificing thermal headroom.
Two fans running at the same speed can reinforce the same frequencies and create unwanted resonance. The V8 ACE 3DHP offsets front and rear fan speeds to reduce harmonic resonance while maintaining strong airflow.
The Intel and AMD models share the same cooling architecture, fan system, and overall design. Platform-specific base geometry, 3DHP heatpipe design, and thermal capacity are optimized for how each processor transfers heat.
| Model | V8 ACE 3DHP Black Intel |
| Model Number | MAM-T6HP-225PK-RB |
| CPU Socket | Intel® LGA 1851 / 1700 / 1200 / 1151 / 1150 / 1155 / 1156 |
| Color | Black |
| Dimension | 138.95 X136.47 X 167.3mm( 5.47 x 5.37 x 6.58 inch) |
| Heat Sink Material | 2 x 3DHP/ 4 x HP/ Aluminum Fins |
| Fan (Front) | Dimensions (L x H x W): 120 x 120 x 30 mm ( 4.7 x 4.7 x 1.18 inch) Profiles: N/A Quantity (pcs): 1 PCS Speed: 0-2500±250RPM Air Flow (Max): 152.23 m3/h(89.6 CFM) Air Pressure (Max): 3.85 mmH2O MTTF: > 200,000 hours Noise Level (Max): 37 dB(A) Bearing: Loop Dynamic Bearing Connector: 4-Pin PWM Rated Voltage: 12 VDC Rated Current: 0.2 A Safety Current: 0.4 A Power Consumption: 2.4 W |
| Fan (Rear) | Dimensions (L x H x W): 120 x 120 x 30 mm ( 4.7 x 4.7 x 1.18 inch) Profiles: N/A Quantity (pcs): 1 PCS Speed: 0-2050±250RPM Air Flow (Max): 103.64 m3/h(61.0 CFM) Air Pressure (Max): 2.0 mmH2O MTTF: > 200,000 hours Noise Level (Max): 34 dB(A) Bearing: Loop Dynamic Bearing Connector: 4-Pin PWM Rated Voltage: 12 VDC Rated Current: 0.13 A Safety Current: 0.2 A Power Consumption: 1.56 W |
| Warranty | 6 Years |
| Note* | Price, feature and specifications are subject to change without notice |