Description
Gigabyte X570 I AORUS PRO WIFI AMD X570
FEATURES
AMD X570 AORUS Motherboard with Direct 8 Phases IR Digital VRM, Advanced Thermal Design with Extended & Multi-Layered Heatsink, Dual PCIe 4.0 M.2, M.2 Thermal Guard, Intel® WiFi 6 802.11ax, Intel GbE LAN with cFosSpeed, USB 3.1 Gen2 Type-C, RGB Fusion 2.0
- Supports AMD 3rd Gen Ryzenâ„¢/ 2nd Gen Ryzenâ„¢/ 2nd Gen Ryzenâ„¢ with Radeonâ„¢ Vega Graphics/ Ryzenâ„¢ with Radeonâ„¢ Vega Graphics Processors
- Dual Channel ECC/ Non-ECC Unbuffered DDR4, 2 DIMMs
- Direct 8 Phases IR Digital VRM Solution with PowIRstage
- Advanced Thermal Design with Extended & Multi-Layered Heatsink
- Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with one Thermal Guard
- Intel® WiFi 6 802.11ax 2T2R & BT 5
- ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with Nichicon Audio Capacitors
- Intel® GbE LAN with cFosSpeed Internet
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
- Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP
- Rear USB 3.1 Gen2 Type-Câ„¢ Header & HDMI 2.0 support
- Integrated Base Plate & I/O Shield Armor
- Q-Flash Plus update BIOS without installing CPU, Memory and Graphics card
GET READY FOR AMD RYZENâ„¢ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzenâ„¢ Processors. The all-new design is a testament to GIGABYTE’s dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-Câ„¢ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users’ performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzenâ„¢ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzenâ„¢ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
Advanced Thermal Design
On a small mini-ITX board, heat is easily trapped and thermal balance is not easy to achieve. To avoid thermal throttle, an improved thermal solution consisting of a heatsink with cuts, and multi-layered heatsink has been implemented on the X570 I AORUS PRO WIFI. With a LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
SPECIFICATIONS
CPU | AMD Socket AM4, support for: 3rd Generation AMD Ryzenâ„¢ processors/ 2nd Generation AMD Ryzenâ„¢ processors/ 2nd Generation AMD Ryzenâ„¢ with Radeonâ„¢ Vega Graphics processors/ AMD Ryzenâ„¢ with Radeonâ„¢ Vega Graphics processors |
Chipset | AMD X570 |
Memory |
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Onboard Graphics | Integrated Graphics Processor:
Support for up to 3 displays at the same time * For 2nd Generation AMD Ryzenâ„¢ with Radeonâ„¢ Vega Graphics processors/AMD Ryzenâ„¢ with Radeonâ„¢ Vega Graphics processors only. |
Audio |
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LAN | Intel® GbE LAN chip (10/100/1000 Mbit) |
Wireless Communication module |
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Expansion Slots | Integrated in the CPU (PCIEX16):
Integrated in the Chipset:
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Storage Interface | Integrated in the CPU (M2A_SOCKET):
Integrated in the Chipset (M2B_SOCKET):
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USB | Integrated in the CPU:
Integrated in the Chipset:
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Internal I/O Connectors |
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Back Panel Connectors |
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I/O Controller | iTE® I/O Controller Chip |
H/W Monitoring |
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BIOS |
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Unique Features |
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Bundle Software |
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Operating System | Support for Windows 10 64-bit |
Form Factor | Mini-ITX Form Factor; 17.0cm x 17.0cm |
Warranty | 3 Years |
Note | ***Features, Price and Specifications are subject to change without notice. |
Additional information
Brand | |
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Motherboard Chipset | AMD X570 |
Motherboard Form Factor | Mini-ITX |
Motherboard Platform | AMD Motherboard |
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