Direct 8 Phases IR Digital VRM Solution with PowIRstage
Advanced Thermal Design with Extended & Multi-Layered Heatsink
Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with one Thermal Guard
Intel® WiFi 6 802.11ax 2T2R & BT 5
ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with Nichicon Audio Capacitors
Intel® GbE LAN with cFosSpeed Internet
RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP
Rear USB 3.1 Gen2 Type-C™ Header & HDMI 2.0 support
Integrated Base Plate & I/O Shield Armor
Q-Flash Plus update BIOS without installing CPU, Memory and Graphics card
GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE’s dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users’ performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
Advanced Thermal Design
On a small mini-ITX board, heat is easily trapped and thermal balance is not easy to achieve. To avoid thermal throttle, an improved thermal solution consisting of a heatsink with cuts, and multi-layered heatsink has been implemented on the X570 I AORUS PRO WIFI. With a LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors: Support for DDR4 3600(O.C.) / 3400(O.C.) / 3333(O.C.) / 3200(O.C.) / 2933 / 2667 / 2400 / 2133 MHz memory modules
2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules* * ECC is only supported with AMD Ryzen™ PRO-series CPU.
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
Onboard Graphics
Integrated Graphics Processor:
1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz * Support for DisplayPort 1.2 version.
2 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz * Support for HDMI 2.0 version, HDCP 2.2, and HDR.
Support for up to 3 displays at the same time Maximum shared memory of 16 GB
* For 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors only.
Audio
Realtek® ALC1220-VB codec * The back panel line out jack supports DSD audio.
High Definition Audio
2/4/5.1/7.1-channel * To configure 7.1-channel audio, you have to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate * Actual data rate may vary depending on environment and equipment.
Expansion Slots
Integrated in the CPU (PCIEX16):
3rd Generation AMD Ryzen™ processors: 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
2nd Generation AMD Ryzen™ processors: 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16 (PCIEX16)
2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors: 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX16)
Integrated in the Chipset:
1 x M.2 Socket 1 connector for the wireless communication module (M2_WIFI)
Storage Interface
Integrated in the CPU (M2A_SOCKET):
3rd Generation AMD Ryzen™ processors: 1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 4.0 x4/x2 SSD support)
2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors: 1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 3.0 x4/x2 SSD support)
Integrated in the Chipset (M2B_SOCKET):
1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280 SATA and PCIe* x4/x2 SSD support) * For 3rd Generation AMD Ryzen™ processors only.
4 x SATA 6Gb/s connectors
Support for RAID 0, RAID 1, and RAID 10
USB
Integrated in the CPU:
4 x USB 3.2 Gen 1 ports on the back panel
Integrated in the Chipset:
1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support
1 x USB 3.2 Gen 2 Type-A ports (red) on the back panel
2 x USB 3.2 Gen 1 ports available through the internal USB header
2 x USB 2.0/1.1 ports available through the internal USB header
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
2 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
4 x SATA 6Gb/s connectors
2 x M.2 Socket 3 connectors
1 x front panel header
1 x front panel audio header
1 x speaker header
1 x USB 3.2 Gen 1 header
1 x USB 2.0/1.1 header
1 x Trusted Platform Module (TPM) header (2×6 pin, for the GC-TPM2.0_S module only)
1 x Clear CMOS jumper
Back Panel Connectors
1 x DisplayPort
2 x HDMI ports
1 x USB 3.2 Gen 2 Type-A port (red)
4 x USB 3.2 Gen 1 ports
1 x USB Type-C™ port, with USB 3.2 Gen 2 support
1 x Q-Flash Plus button
1 x RJ-45 port
2 x SMA antenna connectors (2T2R)
3 x audio jacks
I/O Controller
iTE® I/O Controller Chip
H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Overheating warning
Fan fail warning
Fan speed control * Whether the fan speed control function is supported will depend on the cooler you install.
BIOS
1 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
Support for APP Center * Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. @BIOS AutoGreen Cloud Station EasyTune Fast Boot Game Boost ON/OFF Charge RGB Fusion Smart Backup Smart Keyboard Smart Survey System Information Viewer USB Blocker
Support for Q-Flash Plus
Support for Q-Flash
Support for Xpress Install
Bundle Software
Norton® Internet Security (OEM version)
cFosSpeed
XSplit Gamecaster Broadcaster (12 months license)
Operating System
Support for Windows 10 64-bit
Form Factor
Mini-ITX Form Factor; 17.0cm x 17.0cm
Warranty
3 Years
Note
***Features, Price and Specifications are subject to change without notice.
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